

Winbond SDRAM
Synchronous DRAM is designed to process data at the same clock speed as the CPU. Therefore, synchronous DRAM is regarded as the core component that is used in high speed processing of large volumes of data. Currently, its usage is expanding to various consumer electronics such as Automotive, Industrial, Networking, DTV, DSC and STB.
Winbond Specialty DRAM
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. SDR, DDR, DDR2, and DDR3 support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test…etc.
Do you know more about Winbond's product uses, technical documents, and solutions related to SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH 32MBIT PARALLEL 64LFBGA
- IC FLASH 64MBIT SPI/QUAD 16SOIC
- IC FLASH 16MBIT SPI/QUAD 8VSOP
- IC FLASH 64MBIT SPI/QUAD 8VSOP
- IC DRAM 1GBIT PARALLEL 96VFBGA
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- IC FLASH
- IC FLASH 4MBIT SPI 104MHZ 8SOIC
- IC FLASH 64MBIT PARALLEL 56TSOP
- IC SDRAM 1GB X16 1066MHZ 96WBGA
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI/QUAD 8VSOP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
