
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that it has been awarded the 7th China IoT Technology Innovation Award 2022 by Elecfans for its continuous pursuit of technological innovation and excellent product performance with the launch of its next generation memory product HYPERRAM™ 3.0.
Established by Elecfans, a leading electronic media in China, the China IoT Innovation Awards has been recognized as one of the most professional, influential evolutions in Chinese IoT industry. The China IoT Innovation Awards aims to discover and recognize outstanding technologies and leaders in the IoT industry, as well as innovative products that have been highly valued and recognized by the market and industry users in the past years, so as to inspire more people to empower the advancement of IoT technology and development of the industry.
The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM. HYPERRAM 3.0 is the third generation of the HYPERRAM family that operates at a maximum frequency of 200MHz with a 1.8V operation voltage, which is the same as both HYPERRAM 2.0 and OCTAL xSPI RAM, but with an increased data-transfer rate of 800MBps – double the rate that was previously available. The new generation HYPERRAM operates via an expanded IO HYPERBUS™ interface with 22 pins.
Low pin count, low power consumption and easy control are three key features of HYPERRAM that help it significantly improve the performance of IoT end devices. HYPERRAM significantly simplifies the PCB layout design, extends mobile devices' battery life, and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM.
According to IResearch, China's AIoT industry has entered a period of rapid growth in 2022, with a corresponding surge in demand for IoT chips and smart devices. The HYPERRAM 3.0 won the China IoT Technology Innovation Award is a high recognition of Winbond's continuous innovation. The HYPERRAM family is ideal for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.
All registered trademarks and other trademarks belong to their respective owners. For more details, please visit Winbond official site.
- IC DRAM 128MBIT PARALLEL 90VFBGA
- IC DRAM 128MBIT PARALLEL 90TFBGA
- IC FLASH 2GBIT SPI 104MHZ 8WSON
- 2G-BIT SERIAL NAND FLASH, 1.8V
- IC DRAM 128MBIT PARALLEL 54VFBGA
- IC FLASH 4MBIT SPI 80MHZ 8SOIC
- IC DRAM 256MBIT PARALLEL 54TFBGA
- IC FLASH 64MBIT SPI 104MHZ 8WSON
- IC FLASH 16MBIT SPI 75MHZ 16SOIC
- IC DRAM 256MBIT PAR 54TSOP II
- IC DRAM 256MBIT PARALLEL 90TFBGA
- IC DRAM 4GBIT PARALLEL 96VFBGA
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
