

Winbond Low Power DDR4/4X SDRAM
Product family is designed based on JESD209-4 following industrial standard.
Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、and Programmable output buffer driver strength. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.
Do you know more about Winbond's product uses, technical documents, and solutions related to Low Power DDR4/4X SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- SPIFLASH, 64M-BIT, DTR, 4KB UNIF
- IC DRAM 16MBIT PAR 50TSOP II
- IC DRAM 1GBIT PARALLEL 84WBGA
- IC DRAM 256MBIT PARALLEL 84WBGA
- IC FLASH 32MBIT PARALLEL 48TFBGA
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC DRAM 256MBIT PAR 54TSOP II
- IC FLASH 32MBIT SPI/QUAD 8XSON
- IC DRAM 2GBIT PARALLEL 134VFBGA
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC FLASH 128MBIT SPI/QUAD 16SOIC
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device

















