

Winbond Low Power DDR2 SDRAM
Winbond’s LPDDR2 SDRAM(Low Power DDR2 SDRAM) product family is designed with specific features to reduce power consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power down mode, Deep power down mode and Programmable output buffer driving strength.
Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、and Programmable output buffer driver strength. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.
Do you know more about Winbond's product uses, technical documents, and solutions related to Low Power DDR2 SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC SDRAM 1GBIT 96BGA
- IC FLASH 1MBIT SPI 75MHZ 8SOIC
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC DRAM 128MBIT PARALLEL 90VFBGA
- IC DRAM 1GBIT PARALLEL 96VFBGA
- IC FLASH 4GBIT PARALLEL 63VFBGA
- IC DRAM 256MBIT PAR 66TSOP II
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- IC FLASH 32MBIT SPI/QUAD 8SOIC
- IC FLASH 16MBIT SPI/QUAD 8USON
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
