

Winbond DDR SDRAM
DDR SDRAM or double-data-rate synchronous dynamic random access memory is a type of memory used in industrial, networking, computers and consumer electronics. It achieves greater bandwidth than the preceding single-data-rate SDRAM by transferring data on both the rising and falling edges of the clock signal.
Winbond Specialty DRAM
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. SDR, DDR, DDR2, and DDR3 support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test…etc.
Do you know more about Winbond's product uses, technical documents, and solutions related to DDR SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH 2GBIT SPI 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH
- IC FLSH 256MBIT PARALLEL 64LFBGA
- IC FLASH 128MBIT SPI 16SOIC
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC DRAM 1GBIT PARALLEL 96VFBGA
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- IC FLASH 64MBIT SPI 104MHZ 8WSON
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC FLSH 256MBIT SPI/QUAD 24TFBGA
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
