

Winbond DDR SDRAM
DDR SDRAM or double-data-rate synchronous dynamic random access memory is a type of memory used in industrial, networking, computers and consumer electronics. It achieves greater bandwidth than the preceding single-data-rate SDRAM by transferring data on both the rising and falling edges of the clock signal.
Winbond Specialty DRAM
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. SDR, DDR, DDR2, and DDR3 support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test…etc.
Do you know more about Winbond's product uses, technical documents, and solutions related to DDR SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH
- IC DRAM 16MBIT PAR 50TSOP II
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH 32MBIT SPI/QUAD 8WSON
- SPIFLASH, 1.8V, 256M-BIT, 4KB UN
- IC FLASH 512MBIT SPI/QUAD 8WSON
- IC FLASH 32MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- SPIFLASH, 64M-BIT, DTR, 4KB UNIF
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI 80MHZ 8WSON
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
