The W25Q64ND, offering capacity of 64Mbits, will be available for sampling early in 2019. The 128Mbit W25Q128ND is also in development, with customer samples expected by

Based on recent market data from WebFeet Research, Winbond took the number-one NOR revenue position in 2019 with a 22.8% market share.

Apart from the existing 3V 512Mb W25Q512JV, the new 1.8V W25Q512NW SPI NOR Flash also features pin-to-pin compatibility, enabling customers to easily upgrade to higher fl

With the prestigious industry-recognized security and safety certifications, TrustME W77Q Secure Flash can satisfy the emerging demands in safety and cybersecurity simult

OTA enables designers to deliver firmware updates over the air to ensure security and reliability of devices, and also offers a way to deliver new features and functional

By extending the 1.2V NOR Flash family to include a 64Mb part, Winbond addresses the requirements of smart devices with a larger code footprint.

The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-

Winbond’s 1.35V DDR3 products support 2133Mbps data rate in both x8 and x16 configurations and are 100% compatible to 1.5V DDR3.

With the prestigious industry-recognized security certification, TrustME W77Q Secure Flash can simultaneously satisfy emerging cybersecurity demands in IoT applications.

The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2.

ISO/SAE 21434 standard protects vehicle and automotive security by specifying the requirements to make automotive systems more robust against cyber-attacks.

This new process will enable Winbond to significantly reduce CO2 emissions in SMT production lines, while also simplifying, shortening and lowering the cost of the SMT pr

Winbond is proud that OFweek recognized its W77Q as the industry’s best Secure Flash device with this award.

Established by Elecfans, a leading electronic media in China, the China IoT Innovation Awards has been recognized as one of the most professional, influential evolutions

A leader in high-performance memory ICs, Winbond is an established supplier of known good die (KGD) needed to assure end-of-line yield in 2.5D/3D assembly.