

Industrial PCs have to be built for a variety of purposes including automation, POS, motor control, display, and test/measurement applications. Often comprising of single-board computers and backplanes which share an underlying design requirement - the need to provide a controlled environment for the installed electronics to survive the rigors of harsh usage environments and conditions. Electronic components are selected for their ability to withstand higher and lower operating temperatures than typical commercial components. Winbond offers a broad based product line of high-performance interface and power products which conform to an Industrial temperature range of -40 ℃ to 85 ℃.
Automation, data communications, and distributed generation are developed enough now to support the concept of a smart grid. This is a digitally enabled electrical grid that gathers, distributes, and acts on information about the behavior of all participants (suppliers and consumers) using Smart Meter technology while improving the efficiency, reliability and sustainability of electricity services. Winbond provides a comprehensive range of IC and FCP products for Smart Grid applications, that include PCIe Bridge/Packet Switches, ReDrivers, Clock generators and Power/Signal switches, that all meet the requirements of a wider range temperature, low power and smaller package profile to support this growing trend.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Industrial systems that create safer and efficient environments for Industrial market.
- IC DRAM 2GBIT PARALLEL 96VFBGA
- IC DRAM 256MBIT PARALLEL 60VFBGA
- IC FLASH 1GBIT PARALLEL 48VFBGA
- IC DRAM 1GBIT PARALLEL 78WBGA
- IC DRAM 1GBIT PARALLEL 78WBGA
- 128MB HYPERRAM X8, 166MHZ, IND T
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
