

Industrial PCs have to be built for a variety of purposes including automation, POS, motor control, display, and test/measurement applications. Often comprising of single-board computers and backplanes which share an underlying design requirement - the need to provide a controlled environment for the installed electronics to survive the rigors of harsh usage environments and conditions. Electronic components are selected for their ability to withstand higher and lower operating temperatures than typical commercial components. Winbond offers a broad based product line of high-performance interface and power products which conform to an Industrial temperature range of -40 ℃ to 85 ℃.
Automation, data communications, and distributed generation are developed enough now to support the concept of a smart grid. This is a digitally enabled electrical grid that gathers, distributes, and acts on information about the behavior of all participants (suppliers and consumers) using Smart Meter technology while improving the efficiency, reliability and sustainability of electricity services. Winbond provides a comprehensive range of IC and FCP products for Smart Grid applications, that include PCIe Bridge/Packet Switches, ReDrivers, Clock generators and Power/Signal switches, that all meet the requirements of a wider range temperature, low power and smaller package profile to support this growing trend.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Industrial systems that create safer and efficient environments for Industrial market.
- IC FLASH 8MBIT SPI 80MHZ 8SOIC
- IC FLASH 8MBIT SPI 133MHZ 8VSOP
- IC FLASH 8MBIT SPI 104MHZ 8USON
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC DRAM 256MBIT PARALLEL 54VFBGA
- IC FLASH 256MBIT PARALLEL 56TSOP
- IC DRAM 2GBIT PARALLEL 78VFBGA
- 1G-BIT SERIAL NAND FLASH, 1.8V
- IC FLSH 256MBIT SPI/QUAD 24TFBGA
- IC DRAM 512MBIT PARALLEL 84WBGA
- IC DRAM 2GBIT PARALLEL 96WBGA
- IC DRAM 1GBIT PARALLEL 96WBGA
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
