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Wired and wireless infrastructure

Wired and wireless infrastructure
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Wired and wireless infrastructure systems that create safer and efficient environments for Wired and wireless infrastructure market.
Winbond Featured Parts (2025/8/8):
- IC DRAM 2GBIT PARALLEL 96VFBGA
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- IC FLASH 16MBIT SPI/QUAD 8WSON
- IC FLASH 8MBIT SPI 104MHZ 8DIP
- IC DRAM 2GBIT PARALLEL 96WBGA
- IC FLASH 4MBIT SPI/QUAD 8WSON
- IC FLASH 2MBIT SPI 104MHZ 8WSON
- IC DRAM 1GBIT PARALLEL 96WBGA
- SECURITY AUTHENTICATION SPIFLASH
- IC FLASH 4MBIT SPI 100MHZ 8SOIC
- IC FLASH 4MBIT SPI 80MHZ 8USON
- IC FLASH 8MBIT SPI 100MHZ 8WSON
Winbond Latest News:
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium

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