

The fast growing embedded market is one of the most diverse in terms of end applications. Embedded includes traditional general purpose ‘embedded CPU’ platforms such as Medical, Robotics, Industrial Control, and Data Acquisition, but can also include Video Surveillance, Automotive, Point-of-Sale, and other more specialized applications. Winbond offers a wide variety of support products for all of these sub segment platforms, ranging from specialized Timing products like processor specific XO and clocks, to Bridge that can connect the latest PCIe based embedded processor families to legacy protocols such as PCI-X, PCI, USB, UART, and more. In fact, Winbond Timing, Switching, and Signal Conditioning products are already used in most embedded platform applications with the most popular embedded processors.
Embedded processors can include CPU chipsets from major CPU vendors, SOC, and FPGA from major vendors which are used across all embedded segments. As an example, the FPGA-Winbond block diagram illustrates the many I/O, power management, and timing functions that Winbond can provide.
Medical Device
Winbond offers the medical device industry’s best combination of bundled solutions optimized for performance and bill-of-materials (BOM) cost.
Multi-Function Printer
Multi-function Peripheral (MFP) applications have been, and continue to be, a primary market segment focus for Winbond.
Smart Grid
Winbond provides a comprehensive range of IC and FCP products for Smart Grid applications.
Security
Winbond delivers a broad range of Video Decoder, PCI Bridge and Packet Switches, Video Switches and Repeaters.
Point of Sale
Point of Sale (POS) applications have been, and continue to be, a primary market segment focus for Winbond.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Embedded Systems systems that create safer and efficient environments for Embedded Systems market.
- IC FLASH 32MBIT SPI/QUAD 16SOIC
- IC DRAM 64MBIT PAR 66TSOP II
- IC FLASH 64MBIT SPI/QUAD 8XSON
- SPIFLASH, 64M-BIT, DTR, 4KB UNIF
- IC DRAM 256MBIT PARALLEL 84WBGA
- IC FLASH 32MBIT PARALLEL 48TFBGA
- IC FLASH 32MBIT SPI/QUAD 8XSON
- IC DRAM 2GBIT PARALLEL 134VFBGA
- IC FLASH 128MBIT SPI/QUAD 16SOIC
- IC DRAM 128MBIT PAR 54TSOP II
- IC FLASH 16MBIT SPI 75MHZ 16SOIC
- IC FLASH 64MBIT SPI/QUAD 8XSON
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
