

Built on longstanding and ongoing collaborative relationships with global equipment manufacturers, service providers and infrastructure operators, Winbond have become the leading technology provider to the communications and telecom industry. TI's portfolio touches every corner of the communications industry, including infrastructure and mobile device-oriented technologies, multimedia processing, power control and management, networking, voice, video, wired and wireless.
Broadband fixed line access
Datacom module
Wired networking
Wireless infrastructure
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Communications equipment systems that create safer and efficient environments for Communications equipment market.
- IC FLASH 512MBIT SPI/QUAD 8WSON
- IC FLASH 32MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- SPIFLASH, 64M-BIT, DTR, 4KB UNIF
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI 8DIP
- IC FLASH 64MBIT SPI 80MHZ 8WSON
- SPIFLASH, 1.8V, 32M-BIT, 4KB UNI
- IC DRAM 2GBIT PARALLEL 96VFBGA
- IC FLASH 32MBIT SPI/QUAD 8WSON
- SPIFLASH, 1.8V, 32M-BIT, 4KB UNI
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date

















