

Built on longstanding and ongoing collaborative relationships with global equipment manufacturers, service providers and infrastructure operators, Winbond have become the leading technology provider to the communications and telecom industry. TI's portfolio touches every corner of the communications industry, including infrastructure and mobile device-oriented technologies, multimedia processing, power control and management, networking, voice, video, wired and wireless.
Broadband fixed line access
Datacom module
Wired networking
Wireless infrastructure
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Communications equipment systems that create safer and efficient environments for Communications equipment market.
- IC DRAM 256MBIT PARALLEL 54VFBGA
- 1G-BIT SERIAL NAND FLASH, 1.8V
- IC FLSH 256MBIT SPI/QUAD 24TFBGA
- IC DRAM 1GBIT PARALLEL 96WBGA
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- IC DRAM 256MBIT PARALLEL 84WBGA
- IC FLSH 32MBIT SPI 104MHZ 16SOIC
- IC FLASH 64MBIT SPI 24TFBGA
- IC SDRAM 1GB X8 1066MHZ 78WBGA
- IC FLASH
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- IC FLSH 256MBIT SPI/QUAD 24TFBGA
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
