

Built on longstanding and ongoing collaborative relationships with global equipment manufacturers, service providers and infrastructure operators, Winbond have become the leading technology provider to the communications and telecom industry. TI's portfolio touches every corner of the communications industry, including infrastructure and mobile device-oriented technologies, multimedia processing, power control and management, networking, voice, video, wired and wireless.
Broadband fixed line access
Datacom module
Wired networking
Wireless infrastructure
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Communications equipment systems that create safer and efficient environments for Communications equipment market.
- IC DRAM 2GBIT PARALLEL 96WBGA
- IC DRAM 1GBIT PARALLEL 78WBGA
- IC DRAM 64MBIT PARALLEL 90TFBGA
- IC FLASH 16MBIT SPI/QUAD 24TFBGA
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- IC FLASH 32MBIT SPI/QUAD 8DIP
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- IC DRAM 2GBIT PARALLEL 96VFBGA
- IC DRAM 1GBIT PARALLEL 96WBGA
- IC FLASH 4MBIT SPI 104MHZ 8SOIC
- IC FLASH 32MBIT PARALLEL 48TSOP
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
- Winbond announced the introduction of its lowest-voltage SpiFlash® memories to date
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
