

In today’s connected world, networking is the backbone that keeps all the data continuously flowing to our cellphones, computers and TV. Networking consists of multiple products including switches, routers and base stations connected to each other linking everyone together. Winbond has multiple products that are used in the networking space which include high performance Timing devices, these provide both performance and flexibility as a timing source and provide multiple fanouts of clock signals for large systems. Winbond switch products provide a way to switch between various data sources and Winbond range of signal integrity solutions which enable data signals to be transmitted over long distances with clean signal conditions.
Base station
Winbond has a range of products that can be integrated into the Radio Interface Unit (RIU) and the Baseband Unit (BBU) of the base station.
Routers and Switches
Winbond - discrete, analog, mixed signal IC solutions for networking applications.
Smartphones
Winbond offers ultra-small packaging solutions that enable mobile phone designers smaller form factors while still providing enhanced features.
Wi-Fi / Bluetooth® Module
Winbond has the various components needed to enable Wi-Fi/Bluetooth modules function at their optimum and also be used in different systems.
Optical Transceiver Modules
Ultra-low jitter timing for Optical Transceiver Modules: provide higher transmission rates, higher capacity, lower per-bit cost, and lower power consumption.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Communications systems that create safer and efficient environments for Communications market.
- IC FLASH 16MBIT SPI 75MHZ 16SOIC
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- IC FLASH 64MBIT SPI/QUAD 8XSON
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- IC FLASH 4MBIT SPI 104MHZ 8SOIC
- IC DRAM 128MBIT PARALLEL 90VFBGA
- IC FLASH 2GBIT PARALLEL 63VFBGA
- IC FLASH 64MBIT SPI/QUAD 24TFBGA
- SPIFLASH, 3V, 16M-BIT, 4KB UNIFO
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
